Sikama International Celebrates 40th Anniversary

Click HERE to read our latest Press Release

 

"Established in July of 1982 by Sig, Kail, and Mariellen Wathne (hence the name, “SiKaMa”), Sikama was founded to design, develop, and manufacture high quality reflow soldering and curing systems utilizing a first of its kind high efficiency conductive heating technology to support the demands of the electronics industry."

 

With an enhanced product roadmap and a growing number of services to support customers, Sikama is positioned better than ever to meet the increasing demands of its customers.


Sikama International, Inc. Congratulates and Supports the Passing of The CHIPS and Science Act of 2022

Click HERE to read our latest Press Release

 

"As the only producer of Made-in-America reflow ovens supporting the semiconductor industry for over 40 years, Sikama International, Inc. is pleased to see and support the passage of The CHIPS and Science Act of 2022."

 

We are excited to see the investment in US leadership of domestic manufacture, design and research to advance the deployment of advanced semiconductor technologies and manufacturing for years to come.


Sikama exhibits at SEMICON West 2022

Click HERE to read our latest Press Release

 

“Sikama International is excited to exhibit at SEMICON West 2022 this July, presenting the innovative Electron Attachment fluxless reflow technology, our upcoming 40th anniversary, and an extensive product line for a broad range of applications providing customers with the highest efficiency, smallest footprint, and most versatility in the industry.”

 

Our President and Owner, Herb Weigel and our Director of Sales and Business Development, Jeffrey Blair, will be attending this year’s SEMICON West 2022.


Sikama exhibits at IMAPS’ 18th International Conference & Exhibition on Device Packaging

Click HERE to read our Press Release on IMAPS’ 2022 Conference

“The focus of our exhibit, Sikama’s fluxless EA UP1200 Oven, is the next generation of safe, fluxless reflow solder solutions for microelectronic soldering applications.”

Sikama exhibits at IMAPS’ 18th International Conference & Exhibition on Device Packaging in Fountain Hills Arizona March 7th, 8th, and 9th.