Gain more performance … Use less resources. Our unique and patented thermal technologies and shuttle systems offer distinct advantages that increase productivity and decrease costs

Our thermal technology combines bottom-up conduction with top-down convection with precise zone by zone temperature calibration and atmosphere control for ultimate precision of your solder or curing process.

With multiple customizable heating and cooling zones each with individual temperature set-points and gas flow controls that ensures a consistent and precise environment for any part geometry or weight.


More Control

Uses conductive plus convective thermal technology with precise zone by zone temperature calibration and atmosphere control for ultimate precision of your solder or curing process.


More Flexibility

Accommodates the most demanding substrates, including high mass, tall height, and unique geometry.


Less Space

Allows maximum configurability to take up less manufacturing floor space.


Less Cost

Uses less electricity and atmospheric gas than the competition.


Our systems have been providing reliable and trusted service to top manufacturers in the electronics industry for over 40 years.

More service, less uncertainty

Sikama’s on-site lab offers complimentary on-site testing for our customers. Whether you send us your parts or visit our factory, we will ensure that our equipment is the perfect fit for your application.

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