Prior to entering the heat zones the temperature of the substrate is stabilized by virtue of the liquid-cooled load zone. Each heated zone has individual set point controls and gas flow controls that maintain platen temperature to within +/-2°C to ensure consistent and precise temperature for reliable, repeatable profiles. The gas is introduced into the reflow chamber through tiny perforations in the conduction heating platens and enters the chamber at the same temperature set for each zone. The internal liquid-cooled zone ensures a process cool-down in an inert atmosphere. Further cooling of the substrates is accomplished as the product exits into the liquid-cooled offload zone.

Parts are transported through the furnace by sweeper bars that can operate continuously or in a “dwell” (timed delay) mode that is a unique feature offered only by Sikama and which produces superior temperature uniformity in the reflow profile. The Falcon 1200 can be interfaced with a computer for storing profiles, monitoring of individual heat zone temperatures as well as speed and time controls and remote operation. A tray to accommodate a computer is supplied. Sikama offers an optional Windows® based software package. KIC ProphetTM thermocouple installation is available as optional equipment (does not include the KIC ProphetTM system itself.)

The Falcon 1200 is well suited for reflow applications involving a broad range of substrate materials including wafer bump reflow, insulated metal-core substrates, BGA, high mass components and die soldering as well as epoxy curing applications including underfill and glob-top. The Falcon 1200’s efficiency of operation and minimal use of electricity and gas are the result of Sikama’s unique patented design for balanced heating and cooling that will increase your yields, improve your bottom line, and safeguard your product integrity and your reputation.

Specifications Falcon 1200SB Falcon 1200WB
Heating Zones 7 7
Cooling Zones 2 1
Load Zones 1 N/A
Total Number of Zones 10 8
Platen Size 12.5 in. W X 13.5 in L. 12.5 in W x 13.5 in L
Minimum Substrate Size N/A 3 inches
Maximum Substrate Size 12 in. W X 12 in. L x 0.9 in. H 12 in W x 12 in L
Weight Limit N/A Approx. 2.5 lbs
Speed Mode(Inches per Minute) 1 in. to 80 in. per min. N/A
Time Mode (Dwell & Travel Time) 15 seconds to 99 min. 59 sec. (per zone) 10 sec. – 99 min, 59 sec.
Temperature (Standard) Up to 420°C Up to 420C
Temperature Accuracy ± 2°C +/- 2C
Warm-up Time to 230°C 15 minutes 15 min. approx.
Coolant Flow 0.5 to 2 GPM .5 to 2 GPM
Alarms Over/Under Temperature, Gas Flow, Coolant Flow & Temperature, Motor Torque, SMEMA (or other) Interface Over/Under Temperature, Gas Flow, Coolant Flow and Temperature, Motor Torque, SMEMA (or other) Interface
Parts Flow (Specify When Ordering) In-Line: L to R or R to L L to R or R to L
Gas Consumption 0-800 cubic feet/hour (process dependent) 1200 CFH
O2 Level < 25 PPM (process dependent) <25 PPM (process dependent)
Voltage (Specify when Ordering) 200 to 240 VAC, 50/60 Hz, 3 Phase 200-240 VAC, 50-60 Hz, 3 Phase
Start-up Power (Kw) 33 kW @ 240 VAC 33kW @ 240 VAC
Power Consumption 50% duty cycle or less (process dependent) 50% Duty Cycle or less (process dependent)
Basic Unit Weight 1000 lbs. 750 lbs
Basic Unit Dimensions L 164 x W 24 x H 45 inches L 178 x W 24 x H 45 inches

L 140 with paddle adapters

May be added at any time – furnish serial number.

Part# Description
2701 Software Package (Windows 7/10)
9648 Uninterruptible Power Supply, 220V
Kit Zero Down Time Kit (2 Years Minimum Support)

System Serial Number must accompany spare parts order.

Part# Description
1095 Flow Switch – Water/Gas
2198 Contactor, Main Power
2200 Heat Zone Assembly
2225 Equipment Manual, Falcon 1200

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