The Ultra Profile 2000 is available as a manually loaded stand-alone system, or an automated system with a SMEMA interface, robotics, and sensors that allows you to link it to other automated assembly machines in your production line. Parts can be transported by the sweeperbars with a cycle time of less than 10 seconds. Its 400° C maximum temperature gives the Ultra Profile 2000 the flexibility to handle die soldering, BGAs, Flip Chips, and IMS with copper or aluminum bases, as well as high density components. Reflow soldering to copper, beryllium, ceramic, and glass epoxy substrates are all possible with the Ultra Profile 2000.

Economy of operation is ensured by SIKAMA’s patented balanced heating and cooling technology, with a nitrogen usage of 200 to 400 CFHg. All this capability comes with a small 38 by 43-inch footprint, which means the Ultra Profile 2000 will fit easily onto your production floor or clean room.

Power Consumption

Heating Zones 4
Cooling Zones 2
Loading Zones 1
Total Number of Zones 7
Platen Size 4.5 in. x 12 in. (114 x 305 mm)
Maximum Substrate Size 3.9 in. x 12 in. (100 x 305 mm)
Weight Limit N/A
Time Mode (Dwell & Travel Time) 7 sec. to 99 min. 59 sec. (per zone)
Temperature (Standard) Up to 400°C
Temperature Accuracy ± 2°C
Warm-up Time to 230°C 15 minutes
Coolant Flow 0.5 to 2 GPM (2 to 8 liters/min.)
Alarms Over/Under Temperature, Gas, Coolant, Motor Torque, SMEMA Interface
Parts Flow (Specify When Ordering) L to R or R to L, Back to Front or Front to Back
Gas Consumption 250-350 cubic feet per hour
O2 Level 10 PPM, 0.25 inch opening
Voltage (Specify when Ordering) 200 to 240 VAC, 50/60 Hz, 1 or 3 Phase
Start-up Power (Kw) 11kW @ 240 VAC
50% or less
Basic Unit Weight 500 lbs. (227 Kg)
Basic Unit Dimensions L 46 x W 38 x H 54 inches (L 117 x W 97 x H 137 cm)

Privacy Preference Center