Sikama International to Exhibit at SEMICON Europa and Productronica 2023

SANTA BARBARA, CA – October 20, 2023 –Sikama International is excited to exhibit at SEMICON Europa and Productronica 2023 this November 14th -17th in Munich, Germany at Messe Munchen. We will be located in Hall B2, coexhibiting alongside our distributors, nanotec International GmbH located in Hall B2, booth 151, and Honeystone located in Hall B2, booth 512.

nanotec international GmbH has provided solutions for semiconductor backend, assembly/packaging and related fields to the European market for over 20 years. Based in Munich, and with additional locations for technical service in Portugal and Malta, nanotec is a long-standing and trusted partner of Sikama International, Inc.

Honeystone Limited provides turnkey solutions and process development in hybrid thick film, multilayer ceramics, batteries and composites, and the advanced packaging – MCM, WLP, MEMS, optoelectronic and power electronics. With its headquarters located in London, UK and sales and service available for Europe, Turkey, and South America, Honeystone is a long-standing and trusted partner of Sikama International, Inc.

Our President and Owner, Herb Weigel, and our Vice President of Commercial Operations, Jeff Blair, will be presenting our revolutionary Electron Attachment fluxless reflow technology alongside our extensive product line of reflow solder systems which offer the highest efficiency, smallest footprint, and most versatility in the industry.

Our patented Electron Attachment technology, developed in partnership with AirProducts™, provides unmatched performance offering truly safe and residue-free fluxless reflow. The system is operated at ambient pressure with an H2/N2 blend at less than 5% hydrogen, ensuring safe operation. The EA1200 utilizes an electrically isolated ceramic roller transport mechanism to move the work item from zone to zone through the oven. Metal oxides are removed in the EA zones before reflow which eliminates the need for flux coating or washing. This technology is shown to be superior to formic acid processes time and time again. In addition, this revolutionary breakthrough offers the safest and lowest cost per wafer of any competing technology.

Come learn more about Sikama International’s RELIABLE, REPEATABLE, RESPONSIBLE, REFLOW, At B2 151 and B2 512.