Sikama exhibits at Wafer-Level Packaging Symposium

Sikama International is excited to exhibit at the Wafer-Level Packaging Symposium this February. Presenting innovative Electron Attachment fluxless reflow technology and our extensive product line, our broad range of applications provide customers with the highest efficiency, smallest footprint, and most versatility in the industry.

Our President and Owner, Herb Weigel and our Director of Sales and Business Development, Jeffrey Blair, will be attending this year’s show, February 15th and 16th. Visit us at Booth #2 to learn more!


Sikama International Celebrates 40th Anniversary

Click HERE to read our latest Press Release

 

"Established in July of 1982 by Sig, Kail, and Mariellen Wathne (hence the name, “SiKaMa”), Sikama was founded to design, develop, and manufacture high quality reflow soldering and curing systems utilizing a first of its kind high efficiency conductive heating technology to support the demands of the electronics industry."

 

With an enhanced product roadmap and a growing number of services to support customers, Sikama is positioned better than ever to meet the increasing demands of its customers.