Sikama offers unique transport systems that can easily handle warped wafers while still offering the advantage of conductive heating combined with convective and radiant heating. Our LIFT transport system utilizes beams that lift wafers and transport them from zone to zone with minimal vibration. Upon entry into each zone, the wafer is gently set on the conductive heating or cooling platen for efficient thermal transfer.
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Sikama is the global leader in wafer bumping, able to handle wafers up to 650mm, including fragile or warped wafers.