Sikama’s conductive heating bottom platens provide highly efficient energy transfer to and from high thermal mass substrates, allowing precise profiling even with large or heavy parts. In addition, Sikama works with customers to develop fixturing to direct heat to specific areas of a substrate, which allows heat to get where you need it, when you need it.
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Using Sikama’s unique combination of conduction + convective + radiant heating technology, we can transfer energy into and out of substrates much more efficiently than competitors. This allows high performance for even the most challenging substrates, including high mass.