Sikama International is excited to exhibit at the Wafer-Level Packaging Symposium this February. Presenting innovative Electron Attachment fluxless reflow technology and our extensive product line, our broad range of applications provide customers with the highest efficiency, smallest footprint, and most versatility in the industry.

Our President and Owner, Herb Weigel and our Director of Sales and Business Development, Jeffrey Blair, will be attending this year’s show, February 15th and 16th. Visit us at Booth #2 to learn more!