As a first in the industry, the EA UP1200 incorporates patented Electron Attachment technology to provide highly efficient, safe, and truly residue-free fluxless reflow. Utilizing N2 cover gas and an H2/N2 blend with less than 5% hydrogen, the result is oxide removal without the use of formic acid or other dangerous chemicals.
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Electron Attachment is a novel flux-free technology based on electron attachment (EA) which can be operated at ambient pressure and normal solder reflow temperatures using non-flammable mixtures of hydrogen in nitrogen.