Efficient Conduction Heating Technology
Conduction reflow has long been the industry standard with over 20 years leadership in solder reflow of hybrid circuits. The same key advantages apply to SMT reflow of printed circuit boards, both rigid and flex, single and double. Because the process is visible, the equipment is very simple to profile. As heat is transferred by conduction rather than radiation, shadowing and preferential absorption effects cannot occur. Components stay in place - no tombstoning - indeed parts align themselves due to surface tension.
